Dresden/Munich– Silicon Saxony and the Czech National Semiconductor Cluster (CNSC) are deepening their cooperation and establishing a joint institutional framework. At SEMICON Europa 2026 in Munich, Frank Bösenberg, Managing Director of Silicon Saxony e. V., and Stanislav Černý, President of the Czech National Semiconductor Cluster, signed a Memorandum of Understanding (MoU) to establish a Czech-Saxon semiconductor cooperation platform. The aim is to strengthen the technological and industrial expertise of both regions, facilitate access to European innovation and research infrastructures for companies and research institutions, and represent common interests at the European level. A key focus will be the further development of the EU Chips Act.
The agreement brings two neighboring semiconductor ecosystems closer together, whose expertise complements each other along the value chain. Saxony is one of the most important European locations for semiconductor manufacturing and microelectronic research. The Czech Republic has extensive expertise in chip design, embedded systems, semiconductor equipment and specialty materials, as well as advanced packaging and power electronics. Together, the two clusters represent more than 800 companies, research institutions, and other organizations.
The signing took place at the Czech pavilion at SEMICON Europa under the auspices of the Czech Ministry of Industry and Trade. Participants included representatives from the European Chip Joint Undertaking, the European Chip Design Platform EuroCDP, the APECS pilot line, and the European Innovation Council. Their participation underscores the commitment to closely integrating this cooperation with European initiatives aimed at strengthening the semiconductor industry.
A joint platform is intended to advance European semiconductor projects.
The new cooperation platform establishes a binding organizational framework for collaboration between the two clusters. A joint expert panel, comprised of six representatives each from Saxony and the Czech Republic, will define strategic priorities, adopt an annual work plan, and coordinate specific activities. Frank Bösenberg and Stanislav Černý will chair the panel. The panel will meet at least twice a year, alternating between Saxony and the Czech Republic.
The cooperation is complemented by an observer group that includes ministries, economic development agencies, regional administrations, and diplomatic missions from both countries. This aims to more closely link economic and scientific initiatives with political and administrative decision-making levels.
In addition to the two clusters, the Czech Semiconductor Centre, the Saxon competence center, and the European APECS pilot line for advanced packaging and heterogeneous integration are also involved in the collaboration. These facilities are part of the European infrastructure being established under the first pillar of the EU Chips Act.
The cooperation platform is intended to promote the following activities in particular:
- European semiconductor projects: Coordination and networking of Czech and Saxon projects within the framework of the planned IPCEI Advanced Semiconductor Technologies (IPCEI AST), including the participating companies, research institutions and supply chains.
- European competence centers: Closer cooperation between the Czech and Saxon Chips Act competence centers, joint services and the mutual mediation of companies and research partners.
- Access to pilot lines: Easier access for companies and research institutions to APECS and other European pilot lines to accelerate the transfer of new semiconductor technologies from research to industrial application.
- European industrial policy: Development of common positions on the further development of the EU Chips Act (Chips Act 2.0) and on related European regulatory initiatives, including the AI Act, the Advanced Materials Act and the Critical Raw Materials Act.
- Technological cooperation: Joint activities in future fields such as quantum technologies, power electronics, automotive electronics and industrial system-on-chip solutions.
- Skilled workers and business development: Cooperation in the development of skilled workers, the promotion of start-ups and medium-sized companies, and joint activities at international specialist events.
The memorandum is initially set for three years. Specific projects, events, and potential financing agreements will be negotiated separately based on this agreement. Frank Bösenberg, Managing Director of Silicon Saxony e. V., explains: “Saxony and the Czech Republic possess industrial and technological expertise that complement each other perfectly along the semiconductor value chain. With this new cooperation platform, we are creating the conditions to combine these strengths more systematically. Crucially, this will generate concrete benefits for companies and research institutions: better access to partners, European research infrastructures, and joint projects. At the same time, we want to consolidate our interests more effectively in the further development of the EU Chips Act. Europe’s competitiveness in microelectronics arises not solely from national initiatives, but from the collaboration of high-performing industrial regions across borders.”
“Saxony and the Czech Republic form a cohesive semiconductor region – from Dresden via Ústí nad Labem and Prague to Brno and Rožnov. The memorandum provides this region with an institutional framework: Two competence centers, the APECS pilot line, and the IPCEI-AST projects on both sides of the border now have a central coordination office. During the negotiations on the ‘Chips Act 2.0,’ we will represent common positions on certain issues,” said Stanislav Černý, President of the Czech National Semiconductor Cluster.
Common interests in European semiconductor policy
The cooperation aims to strengthen the position of both regions within the European semiconductor industry. With the EU Chips Act, Europe is investing in new research and development infrastructure, pilot lines, centers of excellence, and industrial manufacturing capacities. For companies, the ease with which they can access these resources and participate in cross-border development projects is becoming increasingly crucial.
The Czech-Saxon platform addresses this need: it aims to improve the use of existing European instruments, strengthen regional innovation and supply chains, and highlight shared industrial policy interests. In the context of the discussion surrounding the Chips Act 2.0, both clusters intend to contribute the perspective of industrial semiconductor regions to the further development of the European strategy. Silicon Saxony and the Czech National Semiconductor Cluster are already members of the Silicon Europe Alliance, the European association of regional semiconductor clusters. The new agreement complements this collaboration through enhanced bilateral cooperation with concrete working structures and shared project priorities.
64 exhibitors at the Silicon Saxony joint stand
The signing of the cooperation agreement is part of Silicon Saxony’s international trade fair presence at SEMICON Europa 2026. From November 10 to 13, 64 exhibitors from companies, research institutions, and other organizations will present their products and services at the joint booth of the Saxon high-tech network. The participating organizations cover key areas of the semiconductor value chain: from specialty materials and chip design to equipment, manufacturing processes, and automation, as well as advanced packaging, metrology, and testing. Cleanroom and supply infrastructure, along with software solutions for controlling and optimizing production, will also be represented. The joint booth offers companies and research institutions the opportunity to establish new technological partnerships, customer relationships, and supply chain contacts. SEMICON Europa 2026 will take place concurrently with electronica at the Munich Trade Fair Center. With its trade fair appearance and the new Czech-Saxon cooperation platform, Silicon Saxony underscores its commitment to actively shaping international collaboration within the European semiconductor industry and promoting the competitiveness of Saxony through stronger networking along the entire value chain.
