Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us
Home Semiconductor IoT-Internet of Things

ST Delivers Industry’s First FIPS 140-3 Certified TPMs for Computer, Server, and Embedded Systems

State-of-the-art protection certified to latest standard for information security certification, globally recognized and mandatory for US federal procurement

Editorial by Editorial
September 30, 2024
in IoT-Internet of Things, Semiconductor
Reading Time: 2 mins read
STMicroelectronics
Share on FacebookShare on TwitterShare on LinkedIn

The newly certified TPMs, the ST33KTPM2X, ST33KTPM2XSPI, ST33KTPM2XI2C, ST33KTPM2I and ST33KTPM2A provide cryptographic asset protection to meet security and regulatory requirements for critical information systems. They are used in PCs, servers and network-connected IoT devices, as well as medical and infrastructure high-assurance equipment. The ST33KTPM2I is qualified for long lifetime industrial systems. ST33KTPM2A commercialized under the name STSAFE-V100-TPM leverages an AEC-Q100 qualified hardware platform required for automotive integration.

FIPS 140-3 is the latest version of the federal information processing standards (FIPS) specifications for cryptographic modules, superseding FIPS 140-2. “All FIPS 140-2 certificates are scheduled to expire in September 2026,” commented Laurent Degauque, Marketing Director, Connected Security, STMicroelectronics. “By achieving FIPS 140-3, our TPMs are uniquely ready for new designs and let customers create secure, interoperable equipment with extended product and certification lifetimes.”

The products support use cases like secure boot, remote/anonymous attestation, and secure storage with an extended user memory of 200kBytes. In addition, each product supports secure firmware update to add new cryptographic algorithms like PQC and maintain state-of-the-art cryptographic asset protection.

The STSAFE-TPM devices are compliant with multiple industry security standards. These include Trusted Computing Group TPM 2.0 applicable to trusted platform modules, Common Criteria EAL4+, passing the CC framework’s most stringent vulnerability analysis (AVA_VAN.5), and now FIPS 140-3 level 1 with physical security level 3. They offer cryptographic services (ECDSA & ECDH up to 384 bits, RSA up to 4096 including key generation, AES up to 256 bits, SHA1, SHA2 and SHA3), standardized by TCG and compatible with software stacks under FIPS 140-3 certification.

ST also offers provisioning services to load device keys and certificates to reduce the total solution cost and time to market and to guarantee the security of the supply chain.

For more information, visit www.st.com/st33ktpm

Tags: AutomotiveEmbedded SystemsIoTIoT devicesSTMicroelectronics
Editorial

Editorial

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Allied Market Research

Software Defined Vehicles: Future of Mobility and Transportation

May 31, 2025
Solitaire

Solitaire Launches PTK-208 PTZ Camera to Elevate Video Conferencing

May 31, 2025
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • RENEWABLES
    • Sustainability
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement