ST Unveils New Compact Direct Time-of-Flight 3D LiDAR Module
VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2.3K zones, wide ...
Read moreVL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2.3K zones, wide ...
Read moreAAEON will present new and upcoming products at ITS America Conference & Expo, an essential event showcasing the technologies and ...
Read moreLeading edge AI platform provider AAEON announced the release of the CEXD-INTRBL, an open robotics development system from its Embedded ...
Read moreWaldenburg (Germany), Wrocław (Poland) – Würth Elektronik and embedded systems developer Grinn announce their collaboration at embedded world 2026. The ...
Read moreTaipei, Taiwan – AAEON, a leading provider of edge AI platforms, today announced the release of the BOXER-8653AI-PLUS, an embedded AI ...
Read moreTaipei, Taiwan – Industry-leading designer and manufacturer of edge AI solutions AAEON has introduced a new addition to its fanless ...
Read moreIRVINE, Calif. - Lantronix Inc. , a global leader in compute and connectivity IoT solutions powering Edge AI applications, today announced ...
Read moree-con Systems announces camera support for Renesas’ latest RZ/G3E microprocessor, strengthening its partnership with Renesas in powering next-generation embedded vision ...
Read moreAustin, TX –Ambiq Micro, Inc. (Ambiq), a technology leader in ultra-low-power semiconductor solutions for edge AI, today announced the expansion ...
Read moreIRVINE, Calif. -- Lantronix Inc., a global leader in compute and connectivity IoT solutions powering Edge AI applications, today announced that ...
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