Infineon and II-VI Incorporated Signed Agreement for SiC Wafers
Munich, Germany – Infineon Technologies AG and II-VI Incorporated have signed a multi-year supply agreement for silicon carbide (SiC) wafers. ...
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Tag: Infineon
Infineon Presents Future of Payments: from Wearables to Smart Speakers
Munich, Germany – Mobile and contactless payments, digital wallets and biometrics: future topics from a few years ago have now ...
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Infineon’s new HYPERRAM Memory Chip Doubles Bandwidth
Munich, Germany – Infineon Technologies AG has added HYPERRAM 3.0 to its portfolio of high-bandwidth, low-pin count memory solutions. The ...
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Infineon Unveiled the New XENSIV PAS CO2 Shield2Go Board
Munich, Germany – Poor ventilation can lead to rapid accumulation of CO 2. This is a threat to human well-being, as ...
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Infineon Introduces NAC1080 MCU for Passive NFC Lock Applications
Munich, Germany- Infineon Technologies AG has developed a new programmable 32-bit ARM Cortex-M0 microcontroller (MCU) with embedded near-field communication (NFC) ...
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Infineon Introduces the Highly Efficient and Reliable Step-Down DC-DC Converter Modules
Munich, Germany – Infineon Technologies AG now introduces the highly efficient and reliable step-down DC-DC converter modules. Adding to the ...
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Infineon adds AIROC CYW20820 Bluetooth & Bluetooth LE SoC to its AIROC Bluetooth Portfolio
Munich, Germany – Infineon Technologies AG is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system on chip ...
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Infineon links digital to the real world with new decarbonization and IoT solutions at EW 2022
Munich, Germany – Infineon Technologies AG has announced plans to highlight how it links the real to the digital world ...
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