TI unveiled high-performance isolated power modules

Texas Instruments (TI) unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centers to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI’s IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas.

TI’s new isolated power modules with proprietary IsoShield technology pack more power into smaller spaces while reducing area, cost and weight.

“Packaging innovation is revolutionizing the power industry, with power modules at the forefront of this transformation,” said Kannan Soundarapandian, vice president and general manager, High Voltage Products at TI. “TI’s new IsoShield technology delivers what power engineers need most: smaller solutions with improved efficiency and reliability and a faster time to market. It is the latest example of TI’s continued commitment to advance power semiconductor technology to help solve today’s engineering challenges.”

For more information, see ti.com/IsoShield.

Redefining power density with TI’s packaging technology

Historically, power designers have turned to power modules to conserve valuable board space and simplify the design process.[SL1]  As chip sizes reach their physical limits and miniaturization increases in importance, advancements in packaging technology are enabling further performance and efficiency gains.

TI’s new IsoShield technology copackages a high-performance planar transformer and an isolated power stage, offering functional, basic and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data center applications that require reinforced isolation.

Advancing data center and EV performance through power innovations

Power density innovations are nowhere more critical than in today’s evolving data center and automotive designs. Meeting design requirements in those applications starts with advanced analog semiconductors – the components that enable smarter, more efficient operations. As global data centers continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI’s IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world’s digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance.

For more information about TI’s proprietary IsoShield technology, see the technical article, “Isolated power modules with IsoShield™ technology cut solution size by as much as 70%.”

Building on our power module innovation

For decades[SL2] , TI has strategically invested in power management technology, with recent developments in power modules featuring both integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack™ technologies, along with a comprehensive portfolio of over 350 power modules with optimized packages[SL3] , TI’s semiconductors empower engineers to maximize performance in any power design or application.

For more information on TI’s power module portfolio, see ti.com/powermodules.

Innovating what’s next in power at APEC 2026

In booth No. 1819 at the Henry B. González Convention Center, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C® applications, including an 800V to 6V DC/DC power distribution board. This design features TI’s portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors.

Pradeep Shenoy, TI computing power technologist, will also present “Reimagining Data Center Power Architecture” from 1:30 p.m. to 2 p.m. Tuesday, March 24, in Expo Theater 1.

For more information about TI at APEC, see ti.com/APEC.

Availability

Preproduction and production quantities of the new isolated power modules are available now on TI.com. Evaluation modules, reference designs and simulation models are also available.

 [SL1]I can see what we mean by this and perhaps it’s okay but can we double check that this  is how we’d characterize it? From my understanding, one of the narrative of power modules was being too big. And that people turned to power modules for the benefits of integration (vs. the discrete approach) but then the perception was that it was too big / bulky, too expensive, etc. for a while. The industry has made progress (TI included) and over the past several years, we’re proven how that is not true. And now, we’re taking it a step further via packaging innovation since we’ve reached the limits of physics.

 [SL2]This may be good place to weave in a nod to our heritage in power management holistically – we are top in power management so wondering if you could you pull that through and then go into power modules?

 [SL3]Same question here on the 350 number and how it compares to competition