Skip to main content

Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us
Home T & M RF & Wireless

VIAVI Introduced the Latest, Enhanced Version of the Vertex Channel Emulation Platform

Vishaka Vardhan by Vishaka Vardhan
August 12, 2026
in RF & Wireless, T & M
Reading Time: 2 mins read
Viavi
Share on FacebookShare on TwitterShare on LinkedIn

Chandler, Ariz. – VIAVI Solutions Inc. has announced the latest, enhanced version of the Vertex channel emulation platform. With 400 MHz instantaneous bandwidth and support for carrier frequencies up to 23.6 GHz, Vertex 6.0 is the industry’s first channel emulator designed for next generation 6G and Wi‑Fi 7/8 testing, natively supporting newly defined 6G waveform requirements and surpassing Wi‑Fi 7/8 bandwidth requirements.

Vertex 6.0 extends VIAVI’s wireless portfolio by bringing real-world RF propagation into the lab, complementing the industry-leading TM500 network emulation platform and TeraVM application and security validation solutions. It is the first Vertex upgrade following VIAVI’s acquisition of Spirent Communications plc’s high-speed Ethernet, network security and channel emulation testing business.

Available in field-replaceable RF modules that integrate seamlessly into an existing 6U Vertex chassis, Vertex 6.0 builds on the 5G FR1/FR2 capabilities of the previous generation and now includes emulation for complex cellular, Wi-Fi, military and aerospace RF technologies. Combined with the VIAVI FR3 MIMO converter and raytracing with Integrated Sensing and Communication (ISAC), the platform acts as a digital twin for RF propagation for use cases including FR3, Wi-Fi 7, AI-RAN and ISAC.

“As wireless technologies become more complex, late-stage issues can present significant risks. Engineers need test environments that can accurately replicate real-world conditions and validate performance from the earliest stages of development,” said Ian Langley, Senior Vice President, Wireless, Security and Applications Business Unit, VIAVI. “Vertex has been the platform of choice for the world’s leading chipset, device and network equipment manufacturers for over a decade, and Vertex 6.0 brings the next leap in capabilities that address the requirements of complex cellular, Wi-Fi and other specialized topologies.”

Each 6U Vertex chassis supports 36 RF ports, 256 digital links and up to 1.6 GHz of bandwidth. For cellular technologies, the platform supports FR3 bands with up to 1 GHz of bandwidth to meet the increased requirements of 6G networks. This includes multiuser (MU) MIMO with phase alignment and support for both TDD and FDD modes.

For Wi-Fi 7/8, it includes native support for 320 MHz and 4096 QAM, supporting 2×2 up to 8×8 configurations. The channel emulator also includes a wide range of modes for land-to-land, land-to-air and air-to-air transmissions, including for anechoic and reverberation OTA chambers, as well as for NTN (LEO, MEO and GEO), mesh, drone and ISAC networks.

Tags: TeraVMVIAVI
Vishaka Vardhan

Vishaka Vardhan


Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT Design
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • MCU
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Viavi

VIAVI Introduced the Latest, Enhanced Version of the Vertex Channel Emulation Platform

August 12, 2026
Critical Manufacturing will exhibit at SEMICON Taiwan 2026

Critical Manufacturing will exhibit at SEMICON Taiwan 2026

August 12, 2026
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement