Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us
Home AI/ML

VIAVI Launches Ultra Ethernet Transport Validation Solution for AI Fabrics

Nimish by Nimish
June 24, 2026
in AI/ML
Reading Time: 2 mins read
VIAVI Solutions

VIAVI Ultra Ethernet Transport validation solution for AI fabrics

Share on FacebookShare on TwitterShare on LinkedIn

Bangalore – VIAVI Solutions today announced the launch of the industry’s first Ultra Ethernet Transport (UET) validation solution for AI fabrics, bringing powerful traffic generation and analysis capabilities to hyperscalers, cloud and neocloud providers, as well as network equipment manufacturers across the broader Ultra Ethernet ecosystem.

The new GPU-free, full-fidelity offering for VIAVI TestCenter is designed to accelerate the rollout of next-generation high-speed AI networks through the validation of scale-out and scale-up AI back-end networks using the Ultra Ethernet Consortium’s (UEC) Ultra Ethernet Stack.

The Ultra Ethernet Stack is purpose-built for large-scale AI and High-Performance Computing (HPC) workloads, with UEC 1.0 introducing a new UET protocol that delivers advanced congestion control and massive scalability to accelerate multi-vendor adoption of Ethernet as a primary transport for AI fabrics.

VIAVI’s UET validation solution enables customers to ensure that their AI fabrics deliver the required performance and resiliency without the cost and complexity of deploying dedicated GPU infrastructure. The solution emulates the transport layer of UET, replicating realistic, stateful AI traffic patterns at scale, including reliable ordered and unordered delivery (ROD/RUD), packet trimming, congestion control and dynamic multipathing. It also supports full-fidelity emulation of AI workloads, such as collective communications (CCL) and large language model (LLM) flows. In addition, the platform enables comprehensive validation of load-balancing mechanisms across the AI fabric, including ECMP, packet spraying and flowlet switching.

“AI clusters will soon scale to millions of endpoints, which means relying on physical GPUs alone to validate network behavior is no longer practical,” said Aniket Khosla, Vice President of Product Management, Optical Transport and High-Speed Ethernet, VIAVI. “While Ultra Ethernet delivers high throughput for AI and HPC along with the benefits of standardization, its success depends on rigorous, realistic testing. The launch of this GPU-free, full-fidelity UET validation solution gives customers the confidence to deploy scalable, high-performance AI fabrics faster and more cost-effectively.”

“As AI data center fabrics grow in size and complexity, traditional validation approaches struggle to keep pace,” said Mahesh Subramaniam, Senior Director of Product Management, AI Data Centers, HPE. “The VIAVI TestCenter platform provides realistic traffic emulation and the granular visibility needed to validate congestion control and transport performance at scale. Through our collaboration, including UET transport validation using the Juniper QFX5240 platform and Junos Evolved with advanced software features such as packet trimming, we are demonstrating how advanced switching and realistic traffic testing enable faster deployment and reliable scaling of Ultra Ethernet in next-generation AI networks.”

Tags: AI FabricsUltra Ethernet Transport (UET)VIAVI Solutions
Nimish

Nimish


Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT Design
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • MCU
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

OMNIVISION

OMNIVISION Unveils Several New Ultra-Thin Medical-Grade LED Cable Modules for Single-Use Endoscopes

June 24, 2026
Vishay Intertechnology,

Vishay Introduce Two Automotive Grade PIN Photodiode Ambient Light Sensors

June 24, 2026
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement