Electronics Era

  • About Us
  • Advertise with Us
  • Contact Us
  • e-Mag
  • Webinars
Header logo on website
Advertisement
Advertisement
Menu
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us
Home T & M

VIAVI Wins Best of Show Awards at Interop Tokyo 2026

Nimish by Nimish
June 12, 2026
in T & M
Reading Time: 2 mins read
VIAVI Solutions

VIAVI Wins Best of Show Awards at Interop Tokyo 2026

Share on FacebookShare on TwitterShare on LinkedIn

Bangalore – VIAVI Solutions today announced that it has won two awards at Interop Tokyo 2026 in collaboration with partner TOYO Corporation. The Best of Show Awards recognize VIAVI’s innovative technologies for testing and validating AI, enterprise, cloud and other advanced network infrastructure deployments.

The Interop Tokyo awards are presented to companies that demonstrate the most innovative products, solutions, and services during the three-day conference and exhibition. This year, VIAVI secured a Best of Show Grand Prize award in the Network Infrastructure/Security/Testing category for its MCP Server Framework for Custom AI Workflows and a Runner Up award for its TestCenter D2 1.6T Appliance high-speed Ethernet test platform.

“We are honored to be selected for two prestigious prizes,” said Tom Fawcett, Senior Vice President and General Manager, Lab and Production, VIAVI. “These awards, which go to the most innovative digital infrastructure technologies, further demonstrate VIAVI’s ongoing leadership in advanced testing solutions that accelerate and enhance the deployment, validation and security of AI, data center and enterprise network infrastructure.”

Since its inception in 1984, Interop Tokyo has become one of the largest ICT (information and Communication Technology) events in Asia. The conference showcases the latest networking products, solutions and services and attracts over 150,000 attendees each year. Award submissions are reviewed by a panel of expert judges that selects winners based on cutting-edge technology and commercial value, highlighting annual IT trends in networking, AI, security and cloud computing.

VIAVI’s Best of Show Winners :

  • VIAVI MCP Server Framework for Custom AI Workflows

VIAVI MCP Server Framework for Custom AI Workflows (part of VIAVI’s NITRO AI portfolio of solutions) delivers MCP servers for TestCenter (network performance testing), CyberFlood (security and application performance testing) and TeraVM (secure access/ZTNA and SSL/IPsec VPN testing). Each MCP server exposes product-specific operational testing capabilities as standardized tools and resources for AI agents, enabling natural-language-driven test execution, results analysis and test automation across custom AI workflows.

  • VIAVI TestCenter D2 1.6T Appliance

The VIAVI TestCenter D2 1.6T Appliance is a high-performance high-speed Ethernet test platform purpose-built to validate and accelerate rollout of next-generation AI data center infrastructure.  Designed for 1.6T Ethernet and AI workloads, it delivers high-capacity traffic generation, AI workload emulation and multivendor interoperability testing, enabling hyperscalers, cloud providers and network equipment manufacturers to accelerate deployment of scalable, high-performance AI-ready networks.

Tags: Interop Tokyo 2026VIAVI Solutions
Nimish

Nimish

Join Our Newsletter

* indicates required
Electronics Era

Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.

Follow Us

Browse by Category

  • 5G testing
  • 5G/6G
  • AC-DC/DC-DC Converters
  • ADAS
  • Aerospace & Defence
  • AI/ML
  • Automation
  • AUTOMOTIVE ELECTRONICS
  • Big Data Analytics
  • Blockchain
  • Cloud Computing
  • Component
  • Connected Cars
  • Data Center
  • Editor's Desk
  • EE-Tech Talk
  • Electronics Components
  • Embedded
  • EVs
  • Future Tech
  • HEVs
  • Industry 4.0
  • Industry News
  • IoT Design
  • IoT-Internet of Things
  • LED & Lighting
  • LEDs
  • Manufacturing
  • Market Research
  • MCU
  • Medical Electronics
  • Mosfets
  • News
  • Oscilloscopes
  • Policy
  • Power Electronics
  • Product News
  • RENEWABLES
  • RF & Wireless
  • Robotic
  • SDN & NFV
  • Security
  • Semiconductor
  • Sensor
  • Smart Machine
  • SMT/PCB/EMS
  • Sustainability
  • T & M
  • Tech Article
  • Tech Blog
  • TECH ROOM
  • Telecom
  • Uncategorized
  • VR / AR
  • White Papers

Recent News

Biwin

Biwin displays Cutting-Edge Memory and Storage Solutions at COMPUTEX 2026

June 12, 2026
Check Point

Check Point Advances Secure AI Transformation for MSPs with New Platform, AI Security Capabilities, and Unified Security Bundles

June 12, 2026
  • About Us
  • Advertise with Us
  • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

No Result
View All Result
  • Home
  • News
    • Industry News
    • Product News
  • TECH ROOM
    • Sensor
    • VR / AR
    • Embedded
    • Medical Electronics
    • Industry 4.0
    • Robotic
    • Automation
    • Smart Machine
    • Component
    • MCU
    • Manufacturing
    • Aerospace & Defence
    • Security
    • Policy
    • RENEWABLES
      • Sustainability
  • Semiconductor
    • AUTOMOTIVE ELECTRONICS
      • EVs
      • HEVs
      • ADAS
      • Connected Cars
    • IoT-Internet of Things
      • Development Kit
      • IoT Design
    • Power Electronics
      • AC-DC/DC-DC Converters
      • Mosfets
      • IGBTs
      • LEDs
  • T & M
    • 5G testing
    • Oscilloscopes
    • SDN & NFV
    • RF & Wireless
  • AI/ML
  • Telecom
    • 5G/6G
  • Future Tech
    • Data Center
    • Cloud Computing
    • Big Data Analytics
  • Webinars
  • Editor’s Pick
    • Tech Article
    • Tech Blog
    • White Papers
    • EE-Tech Talk
    • Market Research
    • Videos
  • EE Awards
    • EE Awards 2025
    • EE Awards 2024
  • MORE
    • E-Mag
    • Events
    • MAGAZINE Subscription
    • Contact Us

© 2022-23 TechZone Print Media | All Rights Reserved

Advertisement
Advertisement