Weebit Nano Ltd , a leading developer and licensor of advanced memory technologies for the global semiconductor industry, confirms two product customers have successfully taped-out (released to manufacturing) chip designs intended for eventual mass production which integrate its ReRAM module. One customer has a prototype already manufactured and functional. Tape-out by product customers is an important milestone on the path to mass production and marks the achievement of one of the three 2026 targets set at Weebit’s 2025 Annual General Meeting.
Overlord Labs has integrated Weebit Nano’s advanced ReRAM technology into the design of its next-generation smart battery management system, enabling significant gains in efficiency and reliability. The chip design was recently taped-out at DB HiTek, which once manufactured and shipped, will deliver compelling advantages in power consumption, cost, and overall performance for high-volume applications.
A second customer taped-out another product earlier and recently received the first silicon of its product prototype. Initial tests show the chip is functioning as expected, including Weebit’s ReRAM.
In both cases the customers plan to continue further testing, characterisation and qualification, a process which can take 12-18 months. Once the products pass these tests, customers will be able to take these products to mass production.
Weebit Nano CEO Coby Hanoch said, “A first commercial product incorporating our ReRAM, and passing initial functional tests, is a significant achievement for Weebit Nano, marking an important step towards mass production. In addition, the tape-out by Overlord shows the great coordination between Overlord, DB HiTek and Weebit.
“Our ReRAM IP is currently being embedded in the design of several next-generation applications under agreements with multiple product companies, and we expect more will tape-out this calendar year. Discussions with additional potential product customers are advancing, driven by growing demand for faster, lower power and better performing embedded non-volatile memory and increased availability through foundries and Integrated Device Manufacturers (IDMs).”
