ST Streamlines Smart-Home Device Integration with Industry-First Matter NFC Chip
STMicroelectronics has unveiled a secure NFC chip designed to make home networks faster and easier to install and scale, leveraging...
Microchip Halves the Power Required to Measure How Much Power Portable Devices Consume
National: Battery-operated devices and energy-restricted applications must track and monitor power consumption without wasting power in the process. To solve...
NTT DATA Launched Four Next-generation Autonomous Cyber Defense Centers in Bengaluru
LONDON – NTT DATA has announced the launch of four next-generation autonomous Cyber Defense Centers powered by AI technologies in...
Selected for NEDO’s Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems
NGK INSULATORS, LTD. has announced that its Research and Development of Thin Film Lithium Niobate (TFLN) Optical Technology for the...
Infineon’s SECORA™ Pay M – new platform for fast and efficient payment and secured FIDO authentication
Munich, Germany – According to a latest study, the foremost experts in fintech and payment markets, forecasts a 153% surge...
Infineon’s SECORA™ ID V2 platform enables industry’s first FIDO Level 3+ certified secured authentication solutions
Munich, Germany – As cyberattacks exploiting security vulnerabilities rise across industries, secured authentication is becoming critical for safeguarding digital identities....
Navitas Signs Strategic Distribution Partnership with WT
TORRANCE, CA – Navitas Semiconductor, the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) and...
Rao Tummala and Leading Companies ASE, TSMC, Intel, Toyota, Honda to Speak at NEPCON JAPAN’s 40th Anniversary
TOKYO, JAPAN — As NEPCON JAPAN approaches its 40th anniversary, RX Japan is gearing up to host an expert-led conference programme, packed...
Future of Data Centers Moves to Two-phase Liquid Cooling as TDP Exceeds 1500W
Thermal Design Power Trends As of 2025, single-phase direct-to-chip (D2C) cooling remains the dominant solution for high-end GPU thermal management....
Yole Group Released of its New Technology & Market Report, Glass Materials for Semiconductor Manufacturing 2025
LYON, France - November 21st, 2025 |Yole Group announces the release of its new technology & market report, Glass Materials...
Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.
