ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation...

HONG KONG - The Hong Kong University of Science and Technology (HKUST) and Suzhou Calmcar Electronics Technology Co., Limited (CalmCar) yesterday...

Bangalore, India – As India accelerates towards electric mobility, CIYES Systems is inviting entrepreneurs, property owners, fleet operators, institutions, and...

Wetzikon/Bangalore - R&M, the globally active developer and provider of high-end infrastructure solutions for data and communications networks, based in...

Cambridgeshire, UK - Anglia Components, one of Europe’s longest-established, independent, authorised distributors of electronic components, is proud to announce that...

The global shift toward electrification, connectivity, and automation is reshaping industries at an unprecedented pace. From electric vehicles and industrial...

LTE Cat.1 5 Click is a new cellular wireless connectivity Click board™ from MIKROE, the embedded solutions company that dramatically cuts development time by...

Direct-cooled thermal management offered by a reflow-compatible, isolated thermal pad significantly improves power density, reliability, and efficiency. Integrated aluminum nitride...

Mumbai -  Brandworks Technologies, India’s fastest-growing design-driven, R&D-led electronics manufacturing powerhouse, has received official recognition for its In-House Research & Development...

With the deepening integration of AIoT, intelligent edge applications are experiencing exponential growth. From real-time recognition in smart security to...