Semiconductor
MediaTek’s Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for the Latest AI Experiences
HSINCHU, Taiwan – MediaTek today launched the Dimensity 9400, the company’s new flagship smartphone chipset optimized for edge-AI applications, immersive gaming,...
Read more
u-blox Extends Reach of PointPerfect GNSS Correction Service via RTCM RTK Data Format
Thalwil, Switzerland –u-blox extends the reach of its PointPerfect GNSS correction service by adding the Radio Technical Commission for Maritime Services...
Read more
MosChip to Exhibit Embedded & Digital Solutions at the Embedded World North America 2024
Santa Clara, USA - MosChip® Technologies, a semiconductor design and product engineering services company with expertise in SILICON | EMBEDDED...
Read more
Imagimob’s Edge AI Solutions are Now Available for the AURIX Product Family
Munich, Germany – Autonomous and automated driving is a megatrend in the automotive industry, along with electrification. AI plays a...
Read more
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
MILPITAS, Calif. — Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to...
Read more
Cambridge GaN Devices Takes Part in G7 And Oecd Intergovernmental Semiconductor Events
Cambridge, UK - Cambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company that develops energy-efficient GaN-based power devices that make...
Read more
Infineon unveils the industry’s first 20 Gbps Universal USB Peripheral Controller
Munich, Germany – Infineon Technologies AG has announced the addition of the EZ-USB™ FX20 programmable USB peripheral controller to its...
Read more
ST Delivers Industry’s First FIPS 140-3 Certified TPMs for Computer, Server, and Embedded Systems
The newly certified TPMs, the ST33KTPM2X, ST33KTPM2XSPI, ST33KTPM2XI2C, ST33KTPM2I and ST33KTPM2A provide cryptographic asset protection to meet security and regulatory...
Read more
Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports
MILPITAS, Calif. — Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to...
Read more
ST Unveils New Generation of SiC Power Technology Tailored for Next-generation EV Traction Inverters
STMicroelectronics is introducing its fourth generation STPOWER silicon carbide (SiC) MOSFET technology. The Generation 4 technology brings new benchmarks in...
Read more
Electronics Era, India's no.1 growing B2B news forum on Electronics and Cutting Edge Technology is exploring the editorial opportunity for organizations working in the Electronics Manufacturing Services(EMS) Industry.
